Business Unit — Product Engineering

Product Engineering

From Concept to Qualified Product — Complete New Product Inception Flow

We develop and manufacture advanced hardware with a structured NPI flow: precision packaging, RF electronics, embedded firmware, precision mechanics and qualification — all under one roof.

140k

Components/Hour SMT

450 m²

Clean Room

GR-468

Telcordia Qualification

20+

Products developed

Our Differentiator

New Product Inception Flow Across Parallel Tracks

Simultaneous development across four independent tracks reduces time-to-market and ensures perfect integration between hardware, software, mechanics and qualification.

New Product Inception Flow — Parallel Tracks — HwIT

Electronic Hardware & RF

Conception → Development → Production → Delivery

›Low-loss PCBs 28–56 GHz
›Altium Designer, experience with Cadence Allegro
›FPGA: Xilinx Vivado, Intel Quartus
›S-parameters 0–60 GHz

Mechanics & Thermal Simulation

Conception → Development → Production → Delivery

›SolidWorks — design & CFD simulation
›FEA: bulging, stress, tolerance stacking
›Vacuum mechanics & liquid cooling
›Progressive stamping, injection molding

Firmware & Software

Conception → Planning → Sprints → Delivery

›ARM and RISC-V processors & microcontrollers
›RTOS: FreeRTOS, Yocto Linux, MQX
›Real-time physical process control: laser cavity, TEC
›CI/CD, automated regression, CLI/API

Tests

Conception → Design → Execution → Transfer

›Automated test development
›Parallel burn-in on devices/equipment
›Environmental tests: HALT, HASS, climate chambers
›Full per-unit traceability

Phase Review Gates

Kickoff › Concept Review › Prototype Review › Pilot Review › Production Release

Clean Room 450 m²

Advanced Packaging & Clean Room

Full precision packaging capabilities — from flip-chip bonding to hermetic sealing — in a controlled environment with state-of-the-art equipment.

Active/Passive Alignment

Fiber-to-chip or chip-to-chip coupling with sub-micrometer precision. Multiple automatic and manual alignment stations.

Flip-Chip Bonding

Die bonding with optical precision. Flip-chip bonding machines for integration of PICs and/or ASIC chips.

Wirebonding

Semi-automatic and manual machines. Au/Al, wedge bonding for high-frequency electrical interconnection.

Hermetic Sealing

Laser seam sealing, cold weld. Telcordia GR-468 qualified hermetization for photonic and/or electronic modules.

Dispensing

Epoxy, underfill, UV adhesive. Automated dispensing machines for precision assembly.

Automated Pigtailing

Automated optical pigtailing machine. Active alignment with IR camera and UV epoxy fixation.

Optical/Vector Network Analyzers

High-frequency electro-optical measurement

ISO 6

Class 1,000 clean room

Medipix3

PIMEGA wirebonding on AlN (Use case)

Track 1

High-Speed Electronics & RF

PCB design for frequencies greater than or equal to 56 GHz, with controlled routing, 3D EM simulation and full S-parameter validation.

PCB High-Speed

Low-loss 28–56+ GHz, 8–18+ layers, 50 Ω coplanar / microstrip / stripline

3D EM Simulation

S11, S21, IL < 3 dB @ 30 GHz measured

Precision Control

Laser driver < 0.1 mA, TEC Controller PID stabilization < 0.01°C

FPGA Design

Xilinx Vivado, Intel Quartus — 100G Ethernet, RDMA, massive LVDS

Design & Simulation Tools

Altium Designer / Cadence Allegro

Multi-layer PCB layout with advanced DRC rules (including mSAP)

Simulation Software

3D electromagnetic simulation and signal integrity

SPICE

Analog simulation of transient and AC circuits

Parallel burn-in

Simultaneous testing of units in production

Track 2

Precision Mechanics & Thermal Simulation

Integrated mechanical design with CFD, FEA and airflow simulation — ensuring thermal performance even in the densest and most critical modules.

CFD — Flow Simulation

Airflow simulation in QSFP-DD/OSFP modules. Laser temperature < 52.5°C in all conditions (25–50°C ambient).

FEA — Structural Analysis

Bulging, stress and tolerance stacking analysis. Top-bottom gap validated at < 0.015 mm for pluggable modules.

Vacuum Mechanics

Hermetization, liquid cooling and leakage management. Use cases: PIMEGA (water-cooled, vacuum) and hermetic optical modules.

Mechanical & Thermal Design and Simulation — Full Stack

3D Design

Parametric assembly modeling

Heat Analysis

Temperature distribution and dissipation

Flow Simulation (CFD)

Airflow, turbulence, pressure

FEA — Simulation

Stress, deformation, tolerances

Manufacturing Prep

Progressive stamping, injection molding

Track 3

Embedded Firmware

From bare-metal to custom Linux — we develop real-time control firmware for photonic products, scientific instrumentation and IoT.

Platforms

NXP i.MX ARM
ARM Cortex-M / Cortex-A / Cortex-R
RISC-V SiFive
Xilinx & Altera (FPGA + ARM)

OS & Frameworks

Embedded Linux (Yocto, Buildroot)
FreeRTOS & Zephyr & MQX
Embedded Debian
BSPs for ARM & RISC-V

Protocols & Control

OIF, SFF, CMIS
PID controls, Laser, TEC, cavities
SiPh Tx & Rx bias and power control
CI/CD, CLI, REST API

Real Use Case

Sub-GHz wavelength locking on a laser with embedded PID in FreeRTOS — stabilization < 10 ms, TEC control with 0.01°C resolution, ALS (Automatic Laser Shutdown) integrated for optical safety.

Track 4

Qualification & Reliability

In-house infrastructure for full qualification — HALT, HASS, HTOL and climate chambers — with failure analysis capability (SEM, FIB, X-ray tomography).

Tests & Capabilities

HALT / HASS — Highly Accelerated Stress & Screening

HTOL — High Temperature Operating Life — 2000h+

Climate chambers — −70°C to +180°C, 2% to 98% RH

THB — Temperature Humidity Bias

Thermal Shock — −40°C to +85°C, rapid cycles

Vibration & Shock — Vibration table, mechanical shock test

MTBF / FIT — Reliability prediction — Arrhenius, Eyring

Failure Analysis — SEM, FIB, Cross-section, X-ray tomography

Standards & Certifications

GR-468 Telcordia

Photonic devices/modules — sealing, lifetime, HTOL 2000h+

JEDEC PCBAs

Qualification of electronic boards and semiconductor components

IPC-6012 PCBs

Performance specification for printed circuit boards

EN 55035 / FCC EMI

Electromagnetic compatibility

Paulínia / SP

SMT Manufacturing — 700 m²

Full SMT assembly line with 140,000 components/hour capacity and full per-unit traceability.

Solder Paste Printing

DEK + SPI

Stencil printing + solder paste inspection by vision

Component Placement

Pick & Place

Large Device Placer + Shield Placer — 140k comp/h

Reflow

12-Zone Oven

Zone-controlled temperature profile for consistent soldering

Optical Inspection

AOI — TR7500

Automated optical inspection of 100% of components

Traceability

Traveller per Unit

BOM, firmware, tests and calibration tracked per serial

Control

Integrated MES

Real-time production, quality and inventory control

140k

components/hour

Installed capacity — Paulínia/SP. Scalable for volumes of thousands to tens of thousands of units/year.

Portfolio

Products in Production

HwIT's own and strategic customer products developed and manufactured — from specification to qualified product delivered to the customer.

HwIT Products

Scientific Instrumentation

PIMEGA

X-ray Detector 9.4 Megapixels — Synchrotron

Water-cooled Vacuum 2000 FPS

Scientific Instrumentation

COT / COR / LBT

Coherent/Quantum Transceiver and Laser Bench

Coherent Quantum High Quality

IoT & Connectivity

LWS300 / NBS300

IoT Sensing Platform — thousands/year

Multi-sensor Connectivity

IoT & Connectivity

NIMBUS

Satellite environmental telemetry (Cirrus Lab)

Rain & Wind Climate CO₂ Satellite

Education

BitDogLab / Peripherals Kit

Embedded educational platform — 6,000 units

ARM Open Source 20+ Sensors & Actuators

Customer Products

Industry 4.0 IoT

EGSA

Gas Truck Telemetry