From Photonic Chip to Qualified Device/Equipment — Complete New Product Inception Flow
Team with 20+ years of development in integrated photonics, integrated lasers, amplifiers and high-speed pluggable modules — for telecom, data centers, AI and quantum applications.
Tens of Thousands
Lasers & SiP packaged in devices
Thousands
Pluggable modules produced
GR-468
Qualified devices
10+
SiPh developed
Understand the Technology
Photonics is the science of using light — instead of electricity — to transmit, process, and detect information. Just as electronics manipulates electrons, photonics manipulates photons, the particles of light.
Imagine sending an 8K movie from New York to Tokyo in milliseconds. Copper cable can't come close — it heats up, loses signal, and has limited bandwidth. Optical fiber, on the other hand, guides light with minimal loss (~0.2 dB/km) and can carry hundreds of terabits per second through a single strand thinner than a human hair.
At the transmitter, a precision laser generates a coherent beam of light. A photonic modulator encodes digital data onto the phase, amplitude, or frequency of that light — like an ultra-fast Morse code. The light travels through the fiber and, at the destination, a photodetector converts the photons back into electrical bits.
Coherent light source that carries the data. Operates in the 1,530–1,625 nm range (infrared — invisible to the human eye).
Guides light with only 0.2 dB/km of loss. A single cable can replace thousands of copper wires.
Encodes billions of bits per second onto light. Simultaneously modulates phase and amplitude (QPSK, 16-QAM) for maximum spectral efficiency.
Converts received photons back into an electrical signal. Sensitive enough to detect signals from 1,000+ km away.
Our Differentiator
Complete flow — from PIC conception to qualified device/module for production. Each phase has defined deliverables and review gates.
Sub-area
Complete expertise in photonic transceivers based on Silicon Photonics technology for high-speed optical communications — from chip design to qualified device/equipment.
Full SiPh PIC
MZM + 90° hybrid integrated, high GBd TIA, Passives
Pluggable modules
Full integration of SiPh, Laser, DSP, EDFA in modules
Industry-standard modules
OIF CFP, CFP2, QSFP-DD, OSFP
SiPh & Lasers
Manufactured in thousands of units and field validated
DCI Modules
Data center interconnect with high throughput and low latency
Metro & Long-Haul
Reaches of up to 4,000 km
Bidirectional Transmission
Double capacity without new fiber
AI & Data Center
SiPh for AI accelerators
Infrastructure
Class 1000 clean room of 450 m² with sub-micrometer precision equipment for high-speed photonic packaging.
Fiber-to-chip coupling with sub-micrometer precision. Multiple active and passive alignment stations.
Optical precision die bonding — flip-chip bonding machines for SiPh with ASIC Die integration.
Semi-automatic and manual machines — Au/Al, wire & wedge bonding. Chip-PCB and chip-chip integration.
Laser seam sealing and cold weld — hermetic goldboxes for lasers and SiPh with GR-468 qualification.
Epoxy, underfill, optical adhesive — precision dispensing for bonding and component fixation.
Automated pigtailing machine and high-speed equipment for validation.
450 m²
Clean room area
20+
Optical packaging equipment
HTOL
1,000+ hours without failure - GR-468
Sub-area
Complete expertise in integrated laser development from prototype to production. Tens of thousands of units produced with reliability qualification for 20+ year lifetime.
Laser — Specifications
Proven Track Record
Sub-area
Python automation framework with 60+ integrated instruments — parallel testing of multiple DUTs simultaneously with full traceability.
Python drivers for Keysight, Yokogawa, Bristol, Anritsu, Thorlabs, DiCon, Sercalo and 80+ other instruments.
Parallel DUTs — BER, OSNR, sensitivity, power, etc. Climate chambers integrated for temperature testing.
Linear responsivity, RSSI per channel/temperature with stored coefficients. Automatic per-DUT test reports.
Talk to our technical team — no-commitment feasibility evaluation. From chip to qualified device/equipment, we cover the full NPI flow.
Careers
Join the most advanced hardware engineering team in Latin America.
View Open Positions