Business Unit — R&D Photonics

R&D Photonics

From Photonic Chip to Qualified Device/Equipment — Complete New Product Inception Flow

Team with 20+ years of development in integrated photonics, integrated lasers, amplifiers and high-speed pluggable modules — for telecom, data centers, AI and quantum applications.

Tens of Thousands

Lasers & SiP packaged in devices

Thousands

Pluggable modules produced

GR-468

Qualified devices

10+

SiPh developed

Understand the Technology

What is Photonics?

Photonics is the science of using light — instead of electricity — to transmit, process, and detect information. Just as electronics manipulates electrons, photonics manipulates photons, the particles of light.

Diagram of a coherent photonic link: TX chip with laser → optical fiber with multiple wavelengths (WDM) → RX chip with photodetector

How does it work in practice?

Imagine sending an 8K movie from New York to Tokyo in milliseconds. Copper cable can't come close — it heats up, loses signal, and has limited bandwidth. Optical fiber, on the other hand, guides light with minimal loss (~0.2 dB/km) and can carry hundreds of terabits per second through a single strand thinner than a human hair.

At the transmitter, a precision laser generates a coherent beam of light. A photonic modulator encodes digital data onto the phase, amplitude, or frequency of that light — like an ultra-fast Morse code. The light travels through the fiber and, at the destination, a photodetector converts the photons back into electrical bits.

Why photonics for data communications?

  • Speed of light — literally: 200,000 km/s in fiber — intercontinental latency under 100 ms.
  • WDM — many channels, one fiber: technique that sends dozens of different wavelengths simultaneously, multiplying capacity without new cables.
  • Immune to electromagnetic interference: glass fiber neither emits nor picks up electrical noise — ideal for industrial environments and dense data centers.
  • Exponential scale: every video call, data stream, cloud AI job, and global financial transaction passes through a photonic link at some point.

Laser

Coherent light source that carries the data. Operates in the 1,530–1,625 nm range (infrared — invisible to the human eye).

Optical Fiber

Guides light with only 0.2 dB/km of loss. A single cable can replace thousands of copper wires.

Modulator

Encodes billions of bits per second onto light. Simultaneously modulates phase and amplitude (QPSK, 16-QAM) for maximum spectral efficiency.

Photodetector

Converts received photons back into an electrical signal. Sensitive enough to detect signals from 1,000+ km away.

Our Differentiator

7-Phase New Product Inception Flow

Complete flow — from PIC conception to qualified device/module for production. Each phase has defined deliverables and review gates.

1

PIC Development & Characterization

  • Design
  • Simulation
  • Fabrication
  • Characterization & Validation
2

Device Modeling & Design

  • Optical & electrical modeling
  • Thermal simulation (CFD)
  • Component selection
  • BOM & supply chain
3

Device Packaging

  • Optical alignment
  • Flip-chip & wirebonding
  • Hermetic sealing
  • Class 1000 Clean Room
4

Device Testing

  • Optical tests
  • Electrical tests
  • Thermal tests
  • Environmental tests
5

Device Control

  • Conditioning circuits
  • Actuation circuits
  • Real-time control firmware
  • Management firmware
6

Product Integration

  • HW + FW + Mechanics
  • System-level testing
  • Pilot production line
  • Per-unit traceability (traveller)
7

Qualification

  • Telcordia GR-468
  • High Temperature Operating Life (HTOL)
  • Thermal Shock & Vibration
  • Life Model - 20+ years

Sub-area

Silicon Photonics & Coherent Transceivers

Complete expertise in photonic transceivers based on Silicon Photonics technology for high-speed optical communications — from chip design to qualified device/equipment.

Full SiPh PIC

MZM + 90° hybrid integrated, high GBd TIA, Passives

Pluggable modules

Full integration of SiPh, Laser, DSP, EDFA in modules

Industry-standard modules

OIF CFP, CFP2, QSFP-DD, OSFP

SiPh & Lasers

Manufactured in thousands of units and field validated

Applications

DCI Modules

Data center interconnect with high throughput and low latency

Metro & Long-Haul

Reaches of up to 4,000 km

Bidirectional Transmission

Double capacity without new fiber

AI & Data Center

SiPh for AI accelerators

Infrastructure

Advanced Packaging

Class 1000 clean room of 450 m² with sub-micrometer precision equipment for high-speed photonic packaging.

Active & Passive Optical Alignment

Fiber-to-chip coupling with sub-micrometer precision. Multiple active and passive alignment stations.

Flip-Chip Bonding

Optical precision die bonding — flip-chip bonding machines for SiPh with ASIC Die integration.

Wirebonding

Semi-automatic and manual machines — Au/Al, wire & wedge bonding. Chip-PCB and chip-chip integration.

Hermetic Sealing

Laser seam sealing and cold weld — hermetic goldboxes for lasers and SiPh with GR-468 qualification.

Precision Dispensing

Epoxy, underfill, optical adhesive — precision dispensing for bonding and component fixation.

Automated Pigtailing

Automated pigtailing machine and high-speed equipment for validation.

Class 1000 Clean Room — 450 m² — Photonic Packaging — HwIT Campinas

450 m²

Clean room area

20+

Optical packaging equipment

HTOL

1,000+ hours without failure - GR-468

Sub-area

Integrated Lasers

Complete expertise in integrated laser development from prototype to production. Tens of thousands of units produced with reliability qualification for 20+ year lifetime.

Laser — Specifications

Spectral coverage C+ Band, 40 nm tuning
Grid Flexgrid 6.25 GHz
Temperature range −20 to +85°C (industrial)
Linewidth Narrow — proven 600G 64QAM
HTOL 2,000+ h — ±2.5 GHz / ±1 dB
Lifetime 20+ years
Integrated Laser — HwIT

Proven Track Record

  • Tens of thousands of lasers produced
  • HTOL 2,000+ hours
  • Field-validated in pluggable modules

Sub-area

Optical Test Automation

Python automation framework with 60+ integrated instruments — parallel testing of multiple DUTs simultaneously with full traceability.

Equipment API

Python drivers for Keysight, Yokogawa, Bristol, Anritsu, Thorlabs, DiCon, Sercalo and 80+ other instruments.

Automated test benches for 100G/200G transceivers and beyond

Parallel DUTs — BER, OSNR, sensitivity, power, etc. Climate chambers integrated for temperature testing.

Calibration & Traceability

Linear responsivity, RSSI per channel/temperature with stored coefficients. Automatic per-DUT test reports.

Working on a photonic product?

Talk to our technical team — no-commitment feasibility evaluation. From chip to qualified device/equipment, we cover the full NPI flow.

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